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BD9G101G 1/20 datashee t tsz02201-0q1q0aj00150-1-2 ? 2011 rohm co., ltd. all rights reserved. 30.aug.2012 rev.001 www.rohm.com tsz22111 ? 14 ? 001 single-chip type with built -in fet switching regulators simple step-down switching regulators with built-in power mosfet BD9G101G general description the BD9G101G is switching regulator with integrated internal high-side 42v power mosfet. it provides 0.5a dc output with small sot23 package. operating frequency is fixed 1.5mhz, allowing the use of small inductor and ceramic capacitor. phase compensation components is built in. the BD9G101G is available in sot-23-6(ssop6) package. features high and wide input range (vcc=6v~42v) 45v/800m internal power mosfet 1.5mhz fixed operating frequency feedback pin voltage 0.75v1.5% internal co mpensated internal over current protection, under voltage locked out, thermal shutdown 0a shutdown supply current 6-lead sot-23 package(ssop6) key specifications input voltage ref. precision (ta=25 ) (ta=-25~105 ) max output current operating temperature max junction temperature 6 42 [v] 1.5[%] 2.0[%] 0.5 [a] (max.) -40 ~105 150 packages ssop6 2.90 L 2.80 L 1.25 L applications industrial distributed power applications automotive applications battery powered equipment oa instruments typical application circuits structure silicon monolithic integrated circuit this product is not designed for normal operation with in a radioactive. figure 1. typical application circuit ssop6
2/20 datasheet d a t a s h e e t BD9G101G tsz02201-0q1q0aj00150-1-2 ? 2011 rohm co., ltd. all rights reserved. 30.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 pin configuration pin description pin no. pin name description 1 bst the pin is power supply for floating power nmos driver. connected a bypass capacitor between the pin and lx pin for bootstrap operation. 2 gnd ground. it should be connected as possible to the output capacitor ground avoiding the high current switch paths. 3 fb voltage feedback pin. this pin is error-amp input, the dcdc is set 0.75v at this pin with feed-back operation. 4 en enable input pin. the dcdc is start-up to apply over 2.0v. this pin is pull-down about 550k ? , the dcdc is shutdown to open or apply under 0.8v. 5 vcc input supply. it should be connected as near as possible to the bypass capacitor. 6 lx power fet switch output. it should be connected as near as possible to the schottky barrier diode, and inductor. block diagram figure 2. pin configuration (top view) figure 3. block diagram
3/20 datasheet d a t a s h e e t BD9G101G tsz02201-0q1q0aj00150-1-2 ? 2011 rohm co., ltd. all rights reserved. 30.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 description of blocks 1. reference this block generates reference voltage and curren t. it start operation by applying en more than 2.0v. it provides reference voltage and current to error-amp , oscillator ,and etc. 2. reg this is a gate drive voltage ge nerator and 4.2v regulator for internal circuit power supply. 3. osc this is a precise wave oscillation circuit wi th operation frequency fixed to 1.5mhz fixed. to protect from output shorted to gnd, frequency fold-back function is built in. 4. soft start this block does soft start to the output voltage of dc/dc comparator, and prevents in-rush current during start-up. soft start time depend on application and start-conditi on because frequency fold-back function is built in. 5. error amp this is an error amplifier what detects out put signal, and outputs pwm control signal. internal reference voltage is set to 0.75v. also, the BD9G101G has internal phase compensated element between input and output. 6. icomp this is a comparator that outputs pwm signal from cu rrent feed-back signal and error-amp output for current-mode. 7. nch fet sw this is an 45v/800m ? power nch mosfet sw that converts inductor current of dc/dc converter. 8. uvlo this is a low voltage error prevention circuit. this prevents internal circuit error during increase of power supply voltage and during decline of power supply voltage. it monitors vcc pin voltage and internal reg voltage, and when vcc voltage becomes 5.4v and below, it turns off all output fet and turns off dc/dc comparator output, and soft start circuit resets. now this threshold has hysteresis of 200mv. 9. en when a voltage of 2.0v or more is applied, it tu rns on, at open or 0v application, it turns off. about 550k ? pull-down resistance is contained within the pin. 10. ocp the current of power mosfet is limited by this function. the power mosfet current is sensed by current sense fet. if the current of power mosfet is over 1.2a(typ), this function reduce duty by pulse ?by- pulse and restrict the and restraint on over current. 11.tsd circuit for preventing malfun ction at high temperature . when it detects an abnormal te mperature exceeding tj=175 , it turns off dc/dc comparator output. the threshold of tsd has hysteresis(25 ). if temperature falls 150 ,the ic automatically returns.
4/20 datasheet d a t a s h e e t BD9G101G tsz02201-0q1q0aj00150-1-2 ? 2011 rohm co., ltd. all rights reserved. 30.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings item symbol ratings unit vcc vcc 45 v maximum input current imax 1.0 a bst to gnd vbst 50 v bst to lx S vbst 7 v en ven 45 v lx vlx 45 v fb vfb 7 v power dissipation pd 0.675 (*1) w operating temperature topr -40 +105 (*2) storage temperature tstg -55 +150 junction temperature tjmax 150 (*1)during mounting of 70701.6t mm 1layer board.reduce by 5.4mw for every 1 increase. (above 25 ) (*2)exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regula tor will go into thermal shutdown. internal thermal shutdown circuitry protects the device from permanent d amage. thermal shutdown engages at tj=175 (typ) and disengages at tj=155 (typ) electrical characteristics ( unless otherwise specified ta = 2 5 , vcc=24v, vo=5v,en=3v ) parameter symbol limit unit condition min typ max circuit current stand-by current ist 0 5 a ven=0v operating current icc 0.7 1.2 ma fb=1.2v under voltage lock out (uvlo) threshold voltage vuv 5.1 5.4 5.7 v hysteresis width vuvhy 200 300 mv oscillator switching frequency fosc 1.3 1.5 1.7 mhz max duty cycle dmax 85 - - % error amp fb pin reference voltage vfbn 0.739 0.750 0.761 v ta=25 vfba 0.735 0.750 0.765 v ta=-25~105 fb pin bias current ifb -100 0 100 na vfb=2.0v soft-start time tsoft 1.2 4.0 - ms current comparator trans-conductance g cs - 3 - a/v output nch mosfet on resistance ronh 800 m ? min on time tmin 100 nsec switch current limit iocp 0.85 1.2 a ctl en thresohold voltage on venon 2.0 vcc v off venoff -0.3 0.8 v en input bias current ren 2.7 5.5 11 a ven=3v not designed to withstand radiation.
5/20 datasheet d a t a s h e e t BD9G101G tsz02201-0q1q0aj00150-1-2 ? 2011 rohm co., ltd. all rights reserved. 30.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operating ratings item symbol ratings unit min typ max input voltage vcc 6 - 42 v output voltage vout 1.0 (*2) - vcc 0.7 (*3) v output current iout - - 500 ma (*2)restricted by minimum on pulse typ. 100nsec (*3)restricted by maxduty ,ron and bst-uvlo. input and output voltage restriction the input voltage range of BD9G101G is limi ted by ron, maxduty(min85%) and preventing malfunction at low voltage between bst and lx(bst-uvlo). bst-uvlo bstuvlo is the function that prevent the ic from abnormal operat ion that is caused by shortage of charge of high-sidefet driving. if the voltage between bst and lx is lower than 1.5v, hi gh-side fet is turned off and there are new pass to charge voltage vcc to bst. bst voltage is charged by vcc and goes over bst-uvlo threshold. as a result , bst-uvlo is turned off. the condition that bst-uvlo is working property is vcc>>(bst-uvlo threshold + vf )+ vout. therefore maximum output voltage is lower than vin -3v. if output voltage is higher than vin-3v, output voltage ripple is boosted by the trigger of bstuvlo. this is no problem in ic operation. max duty , ron maximum output voltage is limited by maxduty(min85%) and fet ron. in the case of io=500ma, vcc drop down 500ma 0.8 =0.6v besides maxduty. vomax = (vcc-ron iomax) 0.85 (casually formula) considering the negative voltage in the case of pulling diode current, formula of maximum output voltage is vomax = vcc 0.7. minimum on pulse minimum output voltage is limited by minimum on pulse (typ 100nsec). output voltage = frequency(typ 1.5mhz) fet on time vin if output voltage is lower than this formula , output ripple voltage is boosted by intermittent spring. bst charging current (normal mode) figure 4. bst-uvlo image nchfet off (bst-uvlo mode) bst charging current (bst-uvlo mode)
6/20 datasheet d a t a s h e e t BD9G101G tsz02201-0q1q0aj00150-1-2 ? 2011 rohm co., ltd. all rights reserved. 30.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 0 200 400 600 800 1000 1200 1400 1600 0 0.2 0.4 0.6 0.8 1 1.2 frequency[khz] fbvoltage [ v ] frequency fold-back function this ic has the frequency fold-back function to prevent fr om over current with the circuit output is shorted. the frequency fold-back has the function th at the frequency is changed by fb voltage. figure.5 shows fb voltage vs frequency characteristics. when the output node is shorted, the ic narrows the frequency to 150khz(typ) so that input current limiting. this ic operates on1.5mhz in case of norma l mode, the voltage of fb is about 0.75v. start-up characteristics when the ic is starting up, frequency reacts to the vo ltage of fb on the function of frequency fold back. for the softstart is operated by internal frequency clock, accord ing to rising to the output voltage, the softstart rising spee d is more faster. please check the using condition and the application waveform (p.10,p13) because of the start-up characteristics changes to the output load and the output capacitor. figure 5. fb voltage -frequency characteristics
7/20 datasheet d a t a s h e e t BD9G101G tsz02201-0q1q0aj00150-1-2 ? 2011 rohm co., ltd. all rights reserved. 30.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 0.741 ? 0.746 ? 0.751 ? 0.756 ? 0.761 ? 6.0 ? 12.0 ? 18.0 ? 24.0 ? 30.0 ? 36.0 ? 42.0 ? fb ? threshold ? [v] input ? voltage ? [v] 75 77 79 81 83 85 87 89 91 93 95 -40 -20 0 20 40 60 80 100 max ? duty[%] ta[ ] 1.2 1.3 1.4 1.5 1.6 1.7 1.8 \ 40 \ 200 20406080100 frequency[mhz] ta[ ] 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 6 121824303642 input ? current ? [ma] vcc ? [v] ta=150 ta=105 ta=25 ta= \ 50 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 \ 40 \ 20 0 20406080100 input ? current ? [ma] ta[ ] vin=42v vin=24v vin=12v vin=6v typical performance characteristics (unless otherwise specified, ta=25 , vcc=12v, vo=5v, en=3v) figure 6. operating cu rrent - input voltage figure 7. operating cu rrent - temperature figure 8. uvlo threshold - temperature figure 9. oscillation fr equency - temperature figure 10. max duty - temperature figure 11. fb pin reference voltage ? input voltage
8/20 datasheet d a t a s h e e t BD9G101G tsz02201-0q1q0aj00150-1-2 ? 2011 rohm co., ltd. all rights reserved. 30.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 0 20 40 60 80 100 120 140 160 180 200 -40-200 20406080100 min_on_pulse[ns] ta[ ] 0 ? 200 ? 400 ? 600 ? 800 ? 1000 ? 1200 ? 1400 ? 1600 ? 1800 ? 2000 ? -40 -20 0 20 40 60 80 100 120 140 160 ocp ? threshold [ma] ta ? [ ] 0.735 ? 0.740 ? 0.745 ? 0.750 ? 0.755 ? 0.760 ? 0.765 ? \ 40 \ 200 20406080100 fb ? threshold ? [v] ta ? [ ] 0 ? 200 ? 400 ? 600 ? 800 ? 1000 ? 1200 ? 1400 ? 1600 ? 1800 ? 2000 ? \ 40 \ 200 20406080100 high \ side ? fet ? ron[m ] ta ? [ ] figure 12. fb threshold - temperature figure 13. nch mosfet on resistance - te m p erature figure 14. ocp threshold- temperature figure 15. min on time - te m p erature figure 16. en threshold voltage - te m p erature 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 \ 40 \ 20 0 20406080100 en ?? threshold ? [v] ta[ ] vin=12v vin=42v vin=6v
9/20 datasheet d a t a s h e e t BD9G101G tsz02201-0q1q0aj00150-1-2 ? 2011 rohm co., ltd. all rights reserved. 30.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 0 10 20 30 40 50 60 70 80 90 100 1 10 100 1000 efficiency [%] output current [ma] vin=8v vin=12v vin=24v vin=42v reference characteristics of typical application circuits bst gnd fb vcc lx en d1 15000pf on/off control c1:4.7f/50v c2:10f/10v l1: 6.8h 12k 68k parts l1 toko dem4518c 1235as-h-100m 10h taiyo yuden nr4018 10h c1 murata grm32eb31h475ka87 4.7f/50v c2 murata grm31cb11a106ka01 10f/10v d1 rohm rb060m-60 figure 18. efficiency - output current vout=5v figure 17. typical application circuit (vout=5v)
10/20 datasheet d a t a s h e e t BD9G101G tsz02201-0q1q0aj00150-1-2 ? 2011 rohm co., ltd. all rights reserved. 30.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 figure 19. start-up characteristics vin=8v , iout=0ma , vout=5v figure 20. start-up characteristics vin=8v , iout=500ma , vout=5v figure 21. start-up characteristics vin=12v, iout=0ma, vout=5v figure 23. start-up characteristics vin=42v , iout=0ma , vout=5v figure 24. start-up characteristics vin=42v, iout=500ma, vout=5v figure 22. start-up characteristics vin=12v, iout=500ma ,vout=5v en 10v/div lx 10v/di v vout 1v/div en 10v/div lx 10v/div vout 1v/div en 20v/div lx 10v/di v vout 1v/div en 10v/div lx 10v/di v vout 1v/div en 20v / div lx 10v/div vout 1v/di v en 10v / div lx 10v / di v vout 1v/div iout 0.2a/div iout 0.2a/div iout 0.2a/div iout 0.2a/div iout 0.2a/div iout 0.2a/div
11/20 datasheet d a t a s h e e t BD9G101G tsz02201-0q1q0aj00150-1-2 ? 2011 rohm co., ltd. all rights reserved. 30.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 figure 25. load response io=50ma ? 200ma figure 26. lx switching/ vout ripple io = 20ma figure 27. lx switching/ vout ripple io=200ma figure 28. frequency response io=100ma, vout=5v figure 29. frequency response io=500ma, vout=5v io [100ma/div] overshoot voltage:134mv vout(ac) [50mv/div] underovershoot voltage:144mv vout:offset 5v 10mv/div vout:offset 5v 10mv/div phase gain phase gain
12/20 datasheet d a t a s h e e t BD9G101G tsz02201-0q1q0aj00150-1-2 ? 2011 rohm co., ltd. all rights reserved. 30.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 0 10 20 30 40 50 60 70 80 90 100 1 10 100 1000 efficiency [%] output current [ma] vin=24v vin=18v vin=36v vin=42v reference characteristics of typical application circuits ?? l1 toko dem4518c 1235as-h-6r8m 6.8h taiyo yuden nr4018 6.8h c1 murata grm32eb31h475ka87 4.7f/50v c2 murata grm31cb11a106ka01 10f/25v d1 rohm rb060m-60 figure 31. efficiency - output current vout=12v figure 30. typical application circuit (vout=12v) *the efficiency is fall when the switching waveform is turning from intermittent mode to continuous mode
13/20 datasheet d a t a s h e e t BD9G101G tsz02201-0q1q0aj00150-1-2 ? 2011 rohm co., ltd. all rights reserved. 30.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 figure 32. start-up characteristics vin=18v, iout=0ma, vout=12v figure 33. start-up characteristics vin=18v, iout=500ma, vout=12v figure 34. start-up characteristics vin=24v, iout=0ma, vout=12v figure 35. start-up characteristics vin=24v, iout=500ma, vout=12v figure 36. start-up characteristics vin=42v, iout=0ma, vout=12v figure 37. start-up characteristics vin=42v, iout=500ma, vout=12v en 20v/div lx 20v/div iout 1 a /di v vout 2v/di v en 20v / div lx 20v/div iout 1 a / di v vout 2v/div en 20v/div lx 20v/di v iout 1a/div vout 2v/div en 20v/div lx 20v/div iout 1 a / di v vout 2v/di v en [50v/di v ] lx [50v/div] iout [1 a /di v ] vout [2v/div] en [50v / di v ] lx [50v / di v ] iout [1 a / di v ] vout [2v /div ]
14/20 datasheet d a t a s h e e t BD9G101G tsz02201-0q1q0aj00150-1-2 ? 2011 rohm co., ltd. all rights reserved. 30.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 figure 41. frequency response io=100ma, vout=12v figure 42. frequency response io=500ma, vout=12v vout:offset 5v 20mv/div vout:offset 5v 20mv/div io [100ma/div] overshoot voltage:460mv vout(ac) [100mv/div] underovershoot voltage:485mv figure 39. lx switching/ vout ripple io = 50ma, vout=12v figure 40. lx switching/ vout ripple io = 200ma, vout=12v figure 38. load response io=50ma ? 200ma, vout=12v phase gain phase gain
15/20 datasheet d a t a s h e e t BD9G101G tsz02201-0q1q0aj00150-1-2 ? 2011 rohm co., ltd. all rights reserved. 30.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 application components selection method (1) inductors something of the shield type that fulf ills the current rating (current value ipecac below), with low dcr is recommended.value of inductance influences inductor ripple current and become s the cause of output ripple. in the same way as the formula below, this ripple current can be made small for as big as the l value of coil or as high as the switching frequency. ipeak =iout + S il/2 [a] (1) (2) ( S il: output ripple current, f: switching frequency) for design value of inductor ripple current, pleas e carry out design tentatively with about 20% 50% of maximum input current. in the BD9G101G, it is recomm ended the below series of 2.2h 10h inductance value. recommended inductor toko de4518c series taiyo yuden nr4018 series (2) output capacitor in order for capacitor to be used in output to reduce out put ripple, low ceramic capacitor of esr is recommended. also, for capacitor rating, on top of putting into consider ation dc bias characteristics, please use something whose maximum rating has sufficient margin with respect to the output voltage. output ripple voltage is looked for using the following formula. (3) please design in a way that it is held within capacity ripple voltage. in the BD9G101G, it is recommended a ceramic capacitor over 10f. (3) output voltage setting error amp internal standard voltage is 0.75v. output voltage is determined as seen in (4) formula. (4) bootstrap capacitor please connect from 15000pf (laminate ceramic capacitor) between bst pin and lx pins. (5)diode select suitable shottky diode for break down voltage and input current. vpp= S il + S il r esr [v] i l figure 43. inductor current figure 44. voltage setting vref 0.75 v vout error amp r1 r2 fb S il= [a] l vin-vout f 1 vin vout r2 vo= 0.75[v] ??? (4) (r1+r2) 2 f co 1
16/20 datasheet d a t a s h e e t BD9G101G tsz02201-0q1q0aj00150-1-2 ? 2011 rohm co., ltd. all rights reserved. 30.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 cautions on pc board layout layout is a critical portion of good powe r supply design. there are several signal s paths that conduct fast changing currents or voltages that can interact with stray inductance or parasi tic capacitance to generate noise or degrade the power supplies performance. to help eliminate these pr oblems, the vcc pin should be bypassed to ground with a low esr ceramic bypass capacitor with b dielectric. care should be taken to minimi ze the loop area formed by the bypass capacitor connections, the vcc pin, and the anode of the catch diode. see figure.45 fo r a pcb layout example. in the BD9G101G, since the lx connection is the switching node, the catch diode and output inductor should be located close to the lx pins, and the area of the pcb conductor minimi zed to prevent excessive capacitive coupling. and gnd area should not be connected directly power gnd, connected avoiding the high current switch paths. the additional external components can be placed approximately as shown. figure 45. reference pcb layout
17/20 datasheet d a t a s h e e t BD9G101G tsz02201-0q1q0aj00150-1-2 ? 2011 rohm co., ltd. all rights reserved. 30.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 power dissipation it is shown below reducing characteristics of power dissipation to mount 70mm 70mm 1.6mm t , 1layer pcb. junction temperature must be designed not to exceed 150 power dissipation estimate the following formulas show how to estimate the device powe r dissipation under continuous mode operations. they should not be used if the device is working in the discontinuous conduction mode. the device power dissipation includes: 1) conduction loss pcon = iout 2 ronh vout/vcc 2) switching loss: psw = 0.41 10 ?9 vcc 2 iout fsw 3) gate charge loss pgc = 4.88 10 ?9 fsw 4) quiescent current loss pq = 0.8 10 ?3 vcc where: iout is the output current (a , ronh is the on-resistance of the high-side mosfet ? , vout is the output voltage (v). vcc is the input voltage (v), fsw is the switching frequency (hz). therefore power dissipation of ic is the sum of above dissipation. pd = pcon + psw + pgc + pq for given tj, tj =ta + ja pd where: pd is the total device power dissipation (w), ta is the ambient temperature ( ) tj is the junction temperature ( ), ja is the thermal resistance of the package ( ) figure 46. power dissipation ( 70mm 70mm 1.6mm t 1layer pcb) 0 0.5 1 1.5 0 255075100125150 p o w e r d i s s i p a t i o n : p d [ i w ) ambient temperature: ta( ) 675mw
18/20 datasheet d a t a s h e e t BD9G101G tsz02201-0q1q0aj00150-1-2 ? 2011 rohm co., ltd. all rights reserved. 30.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 i/o equivalent circuit pin. no pin name pin equivalent circuit pin. no pin name pin equivalent circuit 6 2 1 5 lx gnd bst vcc 4 en s 3 fb bst vc lx gnd fb gnd figure 47. i/o equivalent circuit en gnd
19/20 datasheet d a t a s h e e t BD9G101G tsz02201-0q1q0aj00150-1-2 ? 2011 rohm co., ltd. all rights reserved. 30.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 notes for use (1) about absolute maximum rating when the absolute maximum ratings of app lication voltage, operating temperature range, etc. was exceeded, there is possibility of deterioration or destruction. also, the shor t mode or open mode, etc. de struction condition cannot be assumed. when the special mode where absolute maximum ra ting is exceeded is assumed, please give consideration to the physical safety counter measure for the fuse, etc. (2) about gnd electric potential in every state, please make the electric potential of gnd pin into the minimum electrical potential. also, include the actual excessive effect, and please do it such that the pins, excluding the gnd pin do not become the voltage below gnd. (3) about heat design consider the power dissipation (pd) in actual state of use, and please make heat design with sufficient margin. (4) about short circuit between pins and erroneous mounting when installing to set board, please be mindf ul of the direction of the ic, phase diff erence, etc. if it is not installed correctly, there is a chance that the ic will be destroyed. also, if a foreign objec t enters the middle of output, the middle of output and power supply gnd, etc., ev en for the case where it is shorted, there is a change of destruction. (5) about the operation inside a strong electro-magnetic field when using inside a strong electro-magnetic field, t here is a possibility of error, so please be careful. (6) about checking with set boards when doing examination with the set board, during connection of capacitor to the pin that has low impedance, there is a possibility of stress in the ic, so for every 1 process, pl ease make sure to do electric discharge. as a countermeasure for static electricity, in the process of assembly, do groundin g, and when transporting or storing please be careful. also, when doing connection to the jig in the examination process, please make sure to turn off the power supply, then connect. after that, turn off the power supply then take it off. (7) about common impedance for the power supply and the wire of gnd, lower the comm on impedance, then, as much as possible, make the ripple smaller (as much as possible make the wire thick and short, and lower the ripple from l ? c), etc., then and please consider it sufficiently. (8) in the application, when the mode wher e the vcc and each pin electrical potentia l becomes reversed exists, there is a possibility that the internal circuit will become damaged. fo r example, during cases wherei n the condition when charge was given in the external capacitor, and the vcc was short ed to gnd, it is recommended to insert the bypass diode to the diode of the back current prevention in the vcc series or the middle of each pin-vcc. (9) about ic pin input this ic is a monolithic ic, and between each element, it has p + isolation for element separation and p board. with the n layer of each element and this, the p-n junction is formed, and the parasitic element of each type is composed. for example, like the diagram below, when re sistor and transistor is connected to pin, when gnd (pina) in resistor, when gnd (pina), when gnd (pinb) in transistor (npn), the p-n junction will operate as a parasitic diode. also, during gnd (pin b) in the transistor (npn), through t he n layer of the other elements connected to the above-mentioned parasitic diode , the parasitic npn transistor will operation. on the composition of ic, depending on the electrical potential, the parasitic element will become necessary. through the operation of the parasitic element in terference of circuit operation will arouse, and error, therefore destruction can be caused. therefore please be careful about the applying of voltage lower than the gnd (p board) in i/o pin, and the way of using when parasitic element operating. status of this document the english version of this document is fo rmal specification. a customer may use th is translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority (pin a) gnd p substrate n p n p p (pin a) parasitic element resistor parasitic element transistor ( npn ) gnd p substrate n p n p p (pin b) b n e c gnd n figure 48. example of simple structure of bipolar ic
20/20 datasheet d a t a s h e e t BD9G101G tsz02201-0q1q0aj00150-1-2 ? 2011 rohm co., ltd. all rights reserved. 30.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 ordering part number b d 9 g 1 0 1 g - tr part numbe r package g: ssop6 packaging and forming specification tr: embossed tape and reel external information pin mark lot no ssop6 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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